Imprinted micro-wire rib structure

ABSTRACT

A micro-wire rib structure includes a substrate and a cured layer formed on or over the substrate, the cured layer having a cured-layer surface. A micro-channel is imprinted in the cured layer, the micro-channel having a micro-channel depth, a micro-channel bottom, first and second micro-channel sides, and one or more ribs having opposing rib sides and a rib top defining a rib height less than the micro-channel depth. Each rib is located between the first and second micro-channel sides and extends from the micro-channel bottom toward the cured-layer surface. A cured electrical conductor forming a micro-wire is formed in the micro-channel. The micro-wire extends continuously from the first micro-channel side, over the micro-channel bottom, the rib side(s) and rib top(s) to the second micro-channel side forming a continuous electrical conductor from the first micro-channel side to the second micro-channel side.

CROSS REFERENCE TO RELATED APPLICATIONS

Reference is made to commonly-assigned U.S. patent application Ser. No.(Docket K001866) filed concurrently herewith, entitled Making ImprintedMicro-Wire Rib Structure by Cok; to commonly-assigned U.S. patentapplication Ser. No. (Docket K001728) entitled Ribbed Large-FormatImprinted Structure by Cok; to commonly-assigned U.S. patent applicationSer. No. 13/784,866 filed Mar. 5, 2013 entitled Variable DepthMicro-Channel Structure by Cok; and to commonly-assigned U.S. patentapplication Ser. No. 13/784,869 filed Mar. 5, 2013 entitledMicro-Channel Structure with Variable

Depths by Cok; the disclosures of which are incorporated herein.

FIELD OF THE INVENTION

The present invention relates to imprinted structures havingmicro-channels filled with cured electrically conductive materials.

BACKGROUND OF THE INVENTION

Transparent conductors are widely used in the flat-panel displayindustry to form electrodes that are used to electrically switchlight-emitting or light-transmitting properties of a display pixel, forexample in liquid crystal or organic light-emitting diode displays.Transparent conductive electrodes are also used in touch screens inconjunction with displays. In such applications, the transparency andconductivity of the transparent electrodes are important attributes. Ingeneral, it is desired that transparent conductors have a hightransparency (for example, greater than 90% in the visible spectrum) anda low electrical resistivity (for example, less than 10 ohms/square).

Transparent conductive metal oxides are well known in the display andtouch-screen industries and have a number of disadvantages, includinglimited transparency and conductivity and a tendency to crack undermechanical or environmental stress. Typical prior-art conductiveelectrode materials include conductive metal oxides such as indium tinoxide (ITO) or very thin layers of metal, for example silver or aluminumor metal alloys including silver or aluminum. These materials arecoated, for example, by sputtering or vapor deposition, and arepatterned on display or touch-screen substrates, such as glass.

Transparent conductive metal oxides are increasingly expensive andrelatively costly to deposit and pattern. Moreover, the substratematerials are limited by the electrode material deposition process (e.g.sputtering) and the current-carrying capacity of such electrodes islimited, thereby limiting the amount of power that can be supplied tothe pixel elements. Although thicker layers of metal oxides or metalsincrease conductivity, they also reduce the transparency of theelectrodes.

Transparent electrodes including very fine patterns of conductiveelements, such as metal wires or conductive traces are known. Forexample, U.S. Patent Application Publication No. 2011/0007011 teaches acapacitive touch screen with a mesh electrode, as does U.S. PatentApplication Publication No. 2010/0026664.

It is known in the prior art to form conductive traces includingnano-particles, for example silver nano-particles. The synthesis of suchmetallic nano-crystals is known. U.S. Pat. No. 6,645,444 describes aprocess for forming metal nano-crystals optionally doped or alloyed withother metals. U.S. Patent Application Publication No. 2006/0057502describes fine wirings made by drying a coated metal dispersion colloidinto a metal-suspension film on a substrate, pattern-wise irradiatingthe metal-suspension film with a laser beam to aggregate metalnano-particles into larger conductive grains, removing non-irradiatedmetal nano-particles, and forming metallic wiring patterns from theconductive grains.

More recently, transparent electrodes including very fine patterns ofconductive micro-wires have been proposed. For example, capacitivetouch-screens with mesh electrodes including very fine patterns ofconductive elements, such as metal wires or conductive traces, aretaught in U.S. Patent Application Publication No. 2010/0328248 and U.S.Pat. No. 8,179,381, which are hereby incorporated in their entirety byreference. As disclosed in U.S. Pat. No. 8,179,381, fine conductorpatterns are made by one of several processes, including laser-curedmasking, inkjet printing, gravure printing, micro-replication, andmicro-contact printing. In particular, micro-replication is used to formmicro-conductors formed in micro-replicated channels. The transparentmicro-wire electrodes include micro-wires between 0.5 g and 4 g wide anda transparency of between approximately 86% and 96%.

Conductive micro-wires can be formed in micro-channels embossed in asubstrate, for example as taught in CN102063951, which is herebyincorporated by reference in its entirety. As discussed in CN102063951,a pattern of micro-channels can be formed in a substrate using anembossing technique. Embossing methods are generally known in the priorart and typically include coating a curable liquid, such as a polymer,onto a rigid substrate. A pattern of micro-channels is embossed(impressed) onto the polymer layer by a master having an invertedpattern of structures formed on its surface. The polymer is then cured.A conductive ink is coated over the substrate and into themicro-channels, the excess conductive ink between micro-channels isremoved, for example by mechanical buffing, patterned chemicalelectrolysis, or patterned chemical corrosion. The conductive ink in themicro-channels is cured, for example by heating. In an alternativemethod described in CN102063951, a photosensitive layer, chemicalplating, or sputtering is used to pattern conductors, for example usingpatterned radiation exposure or physical masks. Unwanted material (e.g.photosensitive resist) is removed, followed by electro-deposition ofmetallic ions in a bath.

Capacitive touch-screens with mesh electrodes including very finepatterns of conductive elements are used in portions of a substratewhere transparency is important, for example in an area associated witha display. However, in other portions of a substrate, for example in abezel area around the periphery of a substrate associated with display,transparency is not as important as electrical conductivity in amicro-wire electrically connecting display area electrodes to connectionpads or electrical circuits. In such a peripheral area, very conductiveelectrical bus connections are useful.

However, it is difficult to imprint large areas, particularly with ahigh density of structures, and it is difficult to fill a large,imprinted area with a liquid such as a conductive ink that issubsequently cured. For example, the coffee-ring effect is widely knownto compromise the uniformity of a dried coating because of capillaryflow induced by differential evaporation rates over the extent of thecoating. These difficulties limit the size and conductivity of imprintedmicro-channels with cured conductive inks. In some applications,multiple micro-channels filled with cured conductive ink areelectrically connected to provide improved conductivity. However, suchmultiple micro-channels require more space on a substrate, limiting thesubstrate area that is used for other purposes. Because of suchimprinting and drying problems, it is difficult to form large conductivemicro-wires on a substrate using imprint-and-fill processes.

SUMMARY OF THE INVENTION

There is a need, therefore, for improved methods and materials forforming large-format imprinted structures filled with conductivematerials that provide increased conductivity, reduced area, and simplemanufacturing processes.

In accordance with the present invention, a micro-wire rib structurecomprises:

a substrate;

a cured layer formed on or over the substrate, the cured layer having acured-layer surface;

a micro-channel imprinted in the cured layer, the micro-channel having amicro-channel depth, a micro-channel bottom, first and secondmicro-channel sides, and one or more ribs having opposing rib sides anda rib top defining a rib height less than the micro-channel depth, eachrib located between the first and second micro-channel sides andextending from the micro-channel bottom toward the cured-layer surface;

a cured electrical conductor forming a micro-wire in the micro-channel,the micro-wire extending continuously from the first micro-channel side,over the micro-channel bottom, the rib side(s) and rib top(s), to thesecond micro-channel side forming a continuous electrical conductor fromthe first micro-channel side to the second micro-channel side.

Structures and methods of the present invention provide larger and moreconductive micro-wires using less space than alternative structures andmethods of the prior art. The methods and structures decreases materialrequirements, increase manufacturing speed and simplicity, and requireless equipment.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features and advantages of the present inventionwill become more apparent when taken in conjunction with the followingdescription and drawings wherein identical reference numerals have beenused to designate identical features that are common to the figures, andwherein:

FIG. 1 is a cross-sectional view of a micro-wire rib structure in anembodiment of the present invention;

FIG. 2 is a cross-sectional view of another micro-wire rib structurehaving multiple ribs in an embodiment of the present invention;

FIG. 3 is a cross-sectional view of another micro-wire rib structurehaving conductive nano-particles in an embodiment of the presentinvention;

FIG. 4 is a plan view of a substrate with a display area and aperipheral area with micro-wire rib structures in an embodiment of thepresent invention;

FIG. 5 is a plan view of three micro-wire rib structures in anembodiment of the present invention;

FIGS. 6-7 are flow diagrams illustrating various methods of the presentinvention; and

FIG. 8 is a representation illustrating a wide micro-cavity useful inunderstanding the present invention.

The Figures are not necessarily to scale, since the range of dimensionsin the drawings is too great to permit depiction to scale.

DETAILED DESCRIPTION OF THE INVENTION

Substrates used in combination with displays, for example touch screens,typically have a display area in which transparency is important and aperipheral area used to connect electrodes in the display area toexternal or local electrical components in the peripheral area usingelectrical buses. For example, capacitive touch screens use spaced-apartelectrically connected micro-wires to form electrodes in the displayarea. However, such micro-wires are limited in their current-carryingcapacity so that they are not suitable as high-conductivity electricalbuses for connecting connection pads or electrical components in theperipheral area to the electrodes in the display area. Either multiplesuch micro-wires are used, requiring additional substrate space in theperipheral area, or alternative conductive materials or processes mustbe used, requiring additional manufacturing steps and increasing costs.It is desirable to limit the size of the peripheral area to increase thedisplay area and it is also desirable to reduce the number and varietyof manufacturing steps.

It has been experimentally demonstrated that micro-wires formed bycuring liquid curable inks coated into relatively wide (for examplewider than 20 microns, 40 microns, or 60 microns) micro-channels canhave a problematic shape and distribution. In some experimentalexamples, such wide micro-wires do not extend over the entiremicro-channel bottom of a wide conventional micro-channel and can formseparate conductors on either side and against the walls of a wideconventional micro-channel. Alternatively, wide micro-wires do notextend up to the surface of a cured layer in which the micro-channelsare formed, inhibiting electrical connection to an electrical connectorfrom the wide micro-wire. Moreover, it can be problematic to imprintwide micro-channels since the amount of imprinted volume in an area istoo large relative to the total volume of the area.

Referring to FIG. 8, it has been discovered through experimentation thatmaterials dried within a large area, for example a wide conventionalunstructured micro-channel having a width greater than 20 microns, doesnot dry evenly within the micro-channel. Furthermore, when a liquidmaterial coated over the surface and wide conventional micro-channels ofthe cured layer is removed from the surface of the cured layer to leavethe liquid material only in the wide conventional micro-channels, forexample by wiping, if the wide conventional micro-channel is too widethe liquid material is also removed from the micro-channel by the wipingdevice. Even repeated coatings of the liquid material will not solvethis wiping problem, since the coated liquid material is repeatedlyremoved from the wide conventional micro-channels with the wiper.

As is readily observed in FIG. 8, the dried material is thinner in thecenter than at the edges of the conventional micro-channel. As theconventional micro-channel increases in width, the center of the wideconventional micro-channel can become devoid of material, leavingmaterial only at the sides of the wide conventional micro-channel. Ifthe dried material is a conductive material, the conductivity of thewide conventional micro-channel is greatly reduced, at least in partbecause the wide conventional micro-channel is not filled.

According to various embodiments and methods of the present invention, asubstrate includes wide structured micro-channels with ribs. Thestructured micro-channels are filled with cured conductive materialforming wide structured micro-wires. The wide structured micro-wiresprovide improved conductivity in a smaller space than conventionalmicro-wires formed in conventional unstructured micro-channels withoutribs or a plurality of such micro-wires spaced apart on a substrate. Theribs in the structured micro-channels provide additional surface areathat enhances distribution of liquid curable conductive materials andprevents removal of the liquid curable conductive materials with wipersused to remove the liquid curable conductive materials from the surfaceof the substrate. Thus, the micro-channel ribs enable wide imprintedstructured micro-channels and improved distribution, drying, and curingof curable conductive materials located in the wide structuredmicro-channels, forming wider structured micro-wires with lowerelectrical resistance. Such wider structured micro-wires can replacemultiple electrically connected but spatially separated conventionalmicro-wires, saving space on a substrate without a correspondingreduction in conductivity.

Referring to FIG. 1, in an embodiment of the present invention, amicro-wire rib structure 5 includes a substrate 8 and a cured layer 10with a cured-layer surface 11 formed on or over the substrate 8. Astructured micro-channel 60 is imprinted in the cured layer 10. Thestructured micro-channel 60 has a micro-channel depth 68, amicro-channel bottom 65, first and second micro-channel sides 64, 66,and one or more ribs 20 having opposing rib sides and a rib top 26defining a rib height 24 that is less than the micro-channel depth 68.Each rib 20 is located between the first and second micro-channel sides64, 66 and extends from the micro-channel bottom 65 toward thecured-layer surface 11. According to further embodiments of the presentinvention, the rib 20 has a width 22 and is spaced apart from the firstor second micro-channel side 64, 66 by a distance D. The structuredmicro-channel 60 (hereinafter referred to as micro-channel 60) has amicro-channel width 62.

A cured electrical conductor 32 forming a structured micro-wire 30 islocated in the micro-channel 60. The structured micro-wire 30(hereinafter referred to as micro-wire 30) extends continuously from thefirst micro-channel side 64, over the micro-channel bottom 65, the ribsides and the rib top 26 of the rib 20 to the second micro-channel side66 forming a continuous electrical conductor 32 from the firstmicro-channel side 64 to the second micro-channel side 66.

According to various embodiments of the present invention, the substrate8 is transparent, for example made of glass, or flexible, for examplemade of polymer. Cured layers 10 can include polymers with cross-linkingmaterials that are cured with heat or radiation. A transparent substrate8 can have a transparency to visible electromagnetic radiation greaterthan 50%, 60%, 70%, 80%, 90%, or 95%.

As shown in FIG. 2 in an embodiment of the present invention, themicro-wire rib structure 5 has two ribs 20. The conductive materialforming the micro-wires 30 is distributed across the micro-channel 60from the first micro-channel side 64, across the micro-channel bottom65, on both of the opposed rib sides of each rib 20, over the rib tops26 of the ribs 20, to the second micro-channel side 66.

Referring next to FIG. 3, in an embodiment of the present invention, theelectrical conductor 32 of the micro-wire rib structure 5 includessintered conductive nano-particles 70. These nano-particles 70 can be ametal, a metal alloy, or metal coated, for example include silver orcopper. Liquid, curable conductive inks incorporating suchnano-particles 70 are known in the art.

As shown in FIGS. 1 and 3 in various embodiments of the presentinvention, the micro-channel 60 includes first and second ribs 20, 21,the first rib 20 having a first rib height 24 and the second rib 21having a second rib height 25 different than the first rib height 24.Each rib 20 has a rib width 22, the micro-channel 60 has a micro-channelwidth 62, and the rib width 22 is less than or equal to 50%, 25% 20%, or10% of the micro-channel width 62. Alternatively or in addition, thefirst and second ribs 20, 21 have different rib widths 22.

In an embodiment, the rib height 24 is greater than or equal to one halfof the micro-channel depth 68. In another embodiment, the micro-channel60 has a micro-channel width 62 greater than or equal to 20 microns,greater than or equal to 10 microns, or greater than or equal to 5microns. The micro-channel 60 is formed in the cured layer 10 on or overthe substrate 8.

In yet another embodiment, the distance D between the firstmicro-channel side 62 and the nearest side of the rib 20 is less than 20microns, less than 10 microns, or less than 5 microns. The micro-channel60 can have a depth equal to or less than one micron, two microns, fivemicrons, ten microns, twenty microns, or fifty microns. In an embodimentthe rib height 24 is less than the micro-channel depth 68 by two to tenmicrons. The micro-channel 60 can have a micro-channel width 62 equal toor less than one micron, two microns, five microns, ten microns, 20microns, or 50 microns. The cured layer 10 can have a cured thickness ofabout four to twelve microns, or from two to twenty microns.

In an embodiment, the micro-channel bottom 65 is substantially parallelto the cured-layer surface 11, as shown in the figures. Alternatively,the micro-channel bottom 65 is not parallel to the cured-layer surface11 (not shown).

As shown in FIG. 4 in an embodiment, the micro-wire rib structure 5further includes electrodes 90 and connection pads 80 formed on or overthe substrate 8. In an embodiment, the micro-wires 30, the electrodes90, or the connection pads 80 are formed on or in the cured layer 10 ina common step or with common materials. Thus, in an embodimentconventional structures, for example the connection pads 80 and themicro-wires in the electrode 90 are formed in common steps with commonmaterials as the micro-channels 60 and the micro-wires 30, for exampleusing common imprinting steps with a common stamp, common deposition ofliquid conductive inks, common removal of liquid conductive inks fromthe cured-layer surface 11, and common curing steps. The common stampcan form both structured micro-channels 60 and conventionalmicro-channels useful for electrode 90 or for connection pads 80.Alternatively, in an embodiment, the connection pads and electrodes 90use structured micro-channels 60 and micro-wires 30 of the presentinvention.

The micro-wires 30 electrically connect the electrodes 90 to theconnection pads 8. In yet another embodiment the electrode 90 includesmultiple electrically connected conventional unstructured micro-wiresformed in conventional unstructured micro-channels in the cured layer10. In another embodiment the connection pad 80 is also formed in thecured layer 10 and can include electrically connected conventionalunstructured micro-wires. In an embodiment, the micro-wire 30 is anelectrical bus and has a greater conductivity than one of theconventional unstructured micro-wires of the electrode 90 and uses lessarea over the substrate than an equivalent portion of the electrode 90.

In a further embodiment and as illustrated in FIG. 4, the micro-wire ribstructure 5 further includes a plurality of electrodes 90 andmicro-wires 30 and a corresponding plurality of connection pads 80formed over the substrate 8. A micro-wire 30 connects each of theelectrodes 90 to a corresponding connection pad 80. The connection pads80 can electrically connect to an external electrical element orcomponent or an electrical element or component on, over, or affixed tothe substrate 8 or the cured layer 10.

As shown in FIG. 4, the substrate 8 is transparent and has a displayarea 40 and a separate peripheral area 50. The electrodes 90 are locatedat least partly in the display area 40 and the micro-wires 30 arelocated in the peripheral area 50. The peripheral area 50 has a lowertransparency than the display area 40. In an embodiment, the peripheralarea 50 has a transparency less than or equal to 80%, 60%, 50%, 40%,30%, 20%, or 10% in the visible range of electromagnetic radiation.

In another embodiment, referring to FIG. 5, each micro-wire 30 isseparated from an adjacent micro-wire 30 by a distance less than orequal to 50 microns, 20 microns, or 10 microns. Alternatively or inaddition, each micro-wire 30 is separated from an adjacent micro-wire 30by a distance S less than or equal to the micro-channel width 62.

Because the micro-wires 30 of the present invention, in variousembodiments, are wider and closer together than other conventionalunstructured micro-wires, they more densely cover the substrate 8 andreduce the transparency of the substrate 8. Because the micro-wires 30are located in the peripheral area 50 of the substrate 8, the reductionin transparency is not seen by a user of a display located inassociation with the display area 40. The transparency of an area ismeasured in an area that includes multiple micro-wires and can excludeareas that do not include micro-wires, for example the area betweenelectrodes 90 in the display area 40 or the top, bottom, or right sideof the cured layer 10 where no micro-wires 30 are present in theperipheral area 50 (FIG. 4).

Referring to FIG. 6 in a method of the present invention, the substrate8 is provided in step 100 and a curable layer 12 formed over thesubstrate 8 in step 105, for example on or over the substrate 8 or on alayer on the substrate 8. The curable layer 12 is imprinted in step 110,for example with a stamp having protrusions that correspond to themicro-wire rib structures of the micro-channels 60 and define the firstand second micro-channel sides 64, 66, the micro-channel bottom 65, andthe rib(s) 20 in the micro-channel 60.

The curable layer 12 is cured in step 115 to form the cured layer 10including the cured-layer surface 11 and the micro-channel 60 having themicro-channel depth 68, the micro-channel bottom 65, the first andsecond micro-channel sides 64, 66, and one or more ribs 20 havingopposing rib sides and the rib top 26 with the rib height 24 less thanthe micro-channel depth 66. Each rib 20 is located between the first andsecond micro-channel sides 64, 66 and extends from the micro-channelbottom 65 toward the cured-layer surface 11. The stamp is removed instep 120.

A curable conductive material 31 is located in step 125 in themicro-channel 60. In an embodiment, the curable conductive material 31is deposited in the micro-channels 60, for example by inkjet deposition.In another embodiment, the curable conductive material 31 is coated overthe cured-layer surface 11 and the micro-channels 60. Excess curableconductive material 31 is removed from the cured-layer surface 11 butnot from the micro-channels 60 in step 130. The curable conductivematerial 31 in the micro-channels 60 is cured in step 135, for exampleby heat, radiation or exposure to HCl or HCl vapor, to provide a curedelectrical conductor 32 forming a micro-wire 30 in the micro-channel 60,the micro-wire 30 extending continuously from the first micro-channelside 64, over the micro-channel bottom 65, the rib side(s) and ribtop(s) 26 of the ribs 20, to the second micro-channel side 66 formingthe continuous electrical conductor 32 from the first micro-channel side64 to the second micro-channel side 66.

In an embodiment, the curable layer 12 is formed on or over thesubstrate 8 by coating the substrate 8 using techniques known in theart, such as spin coating, curtain coating, or hopper coating.Alternatively, the curable layer 12 is laminated on or over thesubstrate 8 or layers on the substrate 8.

Referring to FIG. 7 and to FIG. 4 in another method, a plurality ofmicro-wires 30 are formed in micro-channels 60 in the peripheral area 50of the substrate 8 in step 200, a plurality of electrodes 90 are formedin the display area 40 of the substrate 8 in step 210, and acorresponding plurality of connection pads 80 are formed in theperipheral area 50 of the substrate 8 in step 220. The micro-wire 30connects each of the electrodes 90 to the corresponding connection pad80. In an embodiment, the micro-wires 30, electrodes 90, and connectionpads 80 are made at the same time with the same process steps andmaterials. Alternatively, they are made in any order and can use thesame or different processes or materials, including photolithographicprocesses or screen printing. In another method, a display is alignedwith the substrate 8 in step 230 so that pixels in the display emit,reflect, or transmit light through the display area 40 of the substrate8.

As shown in FIG. 5, in an embodiment each micro-channel 60 is formedwith a micro-channel width 62 and each micro-wire 30 is locatedseparately from an adjacent micro-wire 30 by a distance less than orequal to the micro-channel width 62. In other embodiments, the substrate8 provided in step 100 is transparent and has a display area 40 and aseparate peripheral area 50. The electrodes 90 are located in step 210at least partly in the display area 40 and the micro-wires 30 arelocated in step 200 in the peripheral area 50. The electrodes 90 and themicro-wires 30 are formed so that the peripheral area 50 has a lowertransparency than the display area 40. For example, the micro-wires 30in the peripheral area 50 are formed so that the peripheral area 50 hasa transparency less than or equal to 80%, 60%, 50%, 40%, 30%, or 20%. Inanother embodiment, the micro-channels 60 are formed, for example byimprinting (step 110, FIG. 6) with a micro-channel width 62 greater thanor equal to 20 microns or greater than or equal to 10 microns. Inanother embodiment, the ribs 20 are formed (step 110, FIG. 6) with a ribheight 24 that is greater than or equal to one half of the micro-channeldepth 68. Alternatively or in addition, the rib 20 is formed with a ribwidth 22 and the micro-channel 60 is formed with a micro-channel width62 and the rib width 22 is less than or equal to 50%, 40%, 30%, 20%,10%, or 5% of the micro-channel width 62.

Referring back to FIG. 2 and with reference to steps 125 and 130 of FIG.6, the increased surface area provided by the rib(s) 20 within themicro-channel 60 wicks the curable, liquid conductive material 31 overthe various surfaces in the micro-channel 60 to improve distribution ofthe curable, liquid conductive material 31 in the micro-channel 60 (step125). At the same time, the ribs 20 prevent a wiper from reaching toofar toward the micro-channel bottom 65 and excavating the curable,liquid conductive material 31 from the micro-channel 65 (step 130). Evenif curable conductive material 31 is removed from the rib tops 26 bywiping, the liquid, curable conductive material 31 can move back overthe rib tops 26 after the wiper is removed to provide an electricalconductor 32 that extends from the first micro-channel side 64 to thesecond micro-channel side 66. In an embodiment, the coating, wiping, andcuring steps 125, 130, 135 of curable conductive material 31 arerepeated.

In operation, referring back to FIG. 4, a device of the presentinvention is controlled by a controller 85 connected to the connectionpads 80 in the peripheral area 50. The controller 85 provides electricalsignals that are electrically conducted through the micro-wires 30 tothe electrodes 90. Likewise, electrical signals from the electrodes 90are conducted through the micro-wires 30 and the connection pads 80 tothe controller 85. The micro-wires 30 have a higher conductivity thanthe electrodes 90 to reduce the signal-to-noise ratio of any signalsconducted from the electrodes 90 to the controller 85 and a smaller sizethan multiple conventional unstructured micro-wires to reduce the sizeof the peripheral area 50 and relatively increase the size of thedisplay area 40, thereby reducing the overall area required by thesubstrate 8 in combination with a display.

In an embodiment, the controller 85 is external to the substrate 8; inanother embodiment the controller 85 is affixed to or formed over thesubstrate 8 or cured layer 10. In further embodiments, two cured layers10 having micro-wires 30 and electrodes 90 are formed over or on eitherside of the substrate 8. The electrodes 90 in each layer extendorthogonally to the electrodes 90 in the other layer. In a usefulapplication, the electrodes 90 form capacitors that are controlled todetect changes in capacitance from nearby conductors such as fingers,forming a capacitive touch screen. In useful embodiment, the substrate 8is a dielectric and the cured layers 10 are formed on opposing sides ofthe substrate 8. Alternatively, the two cured layers 10 are formed on acommon side of the substrate 8 but are electrically isolated by one ofthe cured layers 10. The cured layers 10 can be dielectric layers.

Additive imprinting processes are known to form small features such asmicro-channels 60 in cured layers 10 at a relatively high ratecompatible with inexpensive roll-to-roll processes with less waste thanother processes such as photo-lithographic processes. Structures withinthe imprinted micro-channels 60 improve the distribution and quantity ofcurable conductive material 31, such as conductive inks, within themicro-channels 60.

Most electrical substrates or printed circuit boards have connectionpads to provide electrical connections to components on the substrate.Electrical buses conduct large currents to the components. Forsubstrates used with displays, such as touch screen substrates, as notedabove it is important to maintain transparency for areas in which thedisplays emit, reflect, or transmit light. In order to provideelectrical connections, buses, and electrodes, the prior art typicallyemploys screen printing with low-resolution and relatively largefeatures, or expensive high-resolution photo-lithographic processes. Thepresent invention provides a low-cost method of forming conductivemicro-wire structures over a substrate with improved conductivity andreduced size.

The micro-channels 60 can have any useful shape, regular or irregular,for example rectangular, polygonal, or with curved edges. Themicro-channels 60 can form long, narrow structures. In applications withmultiple micro-channels 60, the micro-channels 60 can have differentsizes, shapes, areas, lengths, or widths as can the ribs 20 and themicro-wires 30 formed in the micro-channels 60. The micro-wires 30 canbe formed from common materials.

As will be familiar to those skilled in the photo-lithographic arts, theterms over and on are relative terms and by a change in perspective areconsidered below or under. The cured layer 10 is considered to be on orover the substrate 8 but can equally well be considered under or belowthe substrate 8 by reversing the positions of the cured layer 10 and thesubstrate 8. The present invention is not limited by the relativelocations of the cured layer 10 and the substrate 8.

According to various embodiments of the present invention, the substrate8 is any material having a substrate surface on which the first curablelayer 12 can be formed. In an embodiment, the substrate 8 istransparent, flexible, or rigid and has a substantially planar surface.Glass or plastic can both be used. The substrate 8 can have a widevariety of thicknesses, for example 10 microns, 50 microns, 100 microns,1 mm, or more. The substrate 8 can be an insulating dielectric material.In another embodiment, the substrate 8 is a component of a display, suchas a display substrate or display cover of an LCD or OLED display. In anembodiment, the substrate 8 is large enough for a user to directlyinteract therewith, for example using an implement such as a stylus orusing a finger or hand.

Material compositions useful in the curable layer 12 or the curableconductive material 31 can be provided in one state and then processedinto another state, for example converted from a liquid state into asolid state, to cure it. Such conversion can be accomplished in avariety of ways, for example by drying, heating, or exposure toradiation. As used herein, any processing of the curable layer 12 intothe imprinted cured layer 10 is considered to be curing. Similarly,drying, heating, radiating, sintering, welding, or soldering of thecurable conductive material 31 is also curing and as also used hereinany processing of the curable conductive material 31 into the curedelectrical conductor 32 and micro-wire 30 is considered to be curing.Furthermore, useful material compositions can include a set of materialsthat, after deposition and processing, is reduced to a subset of the setof materials, for example by removing solvents from the materialcomposition. For example, a material composition including a solvent isdeposited and then processed to remove the solvent leaving a materialcomposition without the solvent in place. Thus, according to embodimentsof the present invention, a material composition that is deposited on alayer or in the imprinted micro-channels 60 is not necessarily the samecomposition as that found in the cured material composition.

The cured layer 10 is a layer of non-conductive curable material thathas been cured. For example, the cured layer 10 is formed of anon-conductive curable material coated or otherwise deposited on asurface of the substrate 8 to form the curable layer 12 and then curedto form the non-conductive cured layer 10. The substrate-coatednon-conductive curable material is considered herein to be the curablelayer 12 before it is cured and the cured layer 10 after it is cured.Similarly, the cured electrical conductor 32 is an electrical conductor32 formed by locating curable conductive material 31 in themicro-channel 60 and curing the curable conductive material 31 to formthe cured electrical conductor 32 in the micro-channel 60. The curedelectrical conductor 32 is a micro-wire 30. In FIGS. 1, 2, and 3, thecurable layer 12 and cured layer 10 are indicated with same drawingelement, since they represent the same element at different stages ofconstruction. Similarly, curable conductive material 31, the electricalconductor 32, and the micro-wire 30 are indicated with the same drawingelement, since they represent the same element at different stages ofconstruction.

In an embodiment, the non-conductive cured layer 10 is a layer that isimprinted in a single step and cured in a single step. In anotherembodiment, the imprinting step and the curing step are different singlesteps. For example, the curable layer 12 is imprinted in a first stepusing a stamping method known in the art and cured in a second differentstep, e.g. by heat or exposure to radiation. In another embodiment,imprinting and curing the curable layer 12 is done in a single commonstep. The curable layer 12 can be deposited as a single layer in asingle step using coating methods known in the art, e.g. curtaincoating. In an alternative embodiment, the curable layer 12 can bedeposited as multiple sub-layers in a single step using multi-layerdeposition methods known in the art, e.g. multi-layer slot coating,repeated curtain coatings, or multi-layer extrusion coating. In yetanother embodiment, the curable layer 12 includes multiple sub-layersformed in different, separate steps, for example with a multi-layerextrusion, curtain coating, or slot coating machine as is known in thecoating arts. The micro-channel 60 is embossed and cured in the curablelayer 12 in a single step to form the imprinted cured layer 10 and themicro-wires 30 are formed by depositing a curable conductive material 31in the micro-channels 60 and curing the curable conductive material 31to form an electrically conductive micro-wire 30. The conductivematerial 31 can be an ink, a conductive ink, or a non-conductive inkthat is conductive when cured.

The non-conductive cured layer 10 useful in the present invention caninclude a cured polymer material with cross-linking agents that aresensitive to heat or radiation, for example infra-red, visible light, orultra-violet radiation. The polymer material can be a curable materialapplied in a liquid form that hardens when the cross-linking agents areactivated. When a molding device, such as an imprinting stamp having aninverse micro-channel structure is applied to liquid curable material inthe curable layer 12 coated on the substrate 8 and the cross-linkingagents in the curable material are activated, the liquid curablematerial in the curable layer 12 is hardened into the cured layer 10having the micro-channels 60. The liquid curable materials can include asurfactant to assist in controlling coating on the substrate 8.Materials, tools, and methods are known for embossing coated liquidcurable materials to form the cured layers 10 having conventionalsingle-layer micro-channels.

In various embodiments useful in the present invention, cured inks caninclude metal particles, for example the nano-particles 70 or particleswith an electrically conductive shell, for example a metallic shell. Theparticles can be sintered to form a metallic electrical conductor. Themetal nano-particles 70 can be silver or a silver alloy or other metalsor metal alloys, such as or including tin, tantalum, titanium, gold,copper, or aluminum, or alloys thereof. Cured inks can includelight-absorbing materials such as carbon black, a dye, or a pigment.

In another embodiment, curable inks provided in a liquid form aredeposited or located in micro-channels 60 and cured, for example byheating or exposure to radiation such as infra-red, visible light, orultra-violet radiation. The curable ink hardens to form the cured inkthat makes up micro-wires 30. For example, a curable conductive ink withthe conductive nano-particles 70 are located within the micro-channels60 and heated to agglomerate or sinter the nano-particles, therebyforming an electrically conductive micro-wire 30. Materials, tools, andmethods are known for coating liquid curable inks to form micro-wires inconventional unstructured micro-channels and are useful with the presentinvention.

In yet another embodiment, a curable ink can include conductivenano-particles (e.g. 70) in a liquid carrier (for example an aqueoussolution including surfactants that reduce flocculation of metalparticles, humectants, thickeners, adhesives or other active chemicals).The liquid carrier can be located in the micro-channels 60 and heated ordried to remove liquid carrier or treated with hydrochloric acid,leaving a porous assemblage of conductive particles that can beagglomerated or sintered to form a porous electrical conductor in alayer. Thus, in an embodiment, curable inks are processed to changetheir material compositions, for example conductive particles in aliquid carrier are not electrically conductive but after processing forman assemblage that is electrically conductive. In any of these cases,conductive inks or other conducting materials need only be conductiveafter they are cured and any needed processing completed. Conductiveinks are known in the art and are commercially available. Depositedmaterials are not necessarily electrically conductive before patterningor before curing. As used herein, a conductive ink is a material that iselectrically conductive after any final processing is completed and theconductive ink is not necessarily conductive at any other point in themicro-wire 30 formation process.

The micro-wires 30 can be metal, for example silver, gold, aluminum,nickel, tungsten, titanium, tin, or copper or various metal alloysincluding, for example silver, gold, aluminum, nickel, tungsten,titanium, tin, or copper. The micro-wires 30 can include a thin metallayer composed of highly conductive metals such as gold, silver, copper,or aluminum. Other conductive metals or materials can be used.Alternatively, the micro-wires 30 can include cured or sintered metalparticles such as nickel, tungsten, silver, gold, titanium, or tin oralloys such as nickel, tungsten, silver, gold, titanium, or tin.Conductive inks can be used to form the micro-wires 30 with pattern-wisedeposition or pattern-wise formation followed by curing steps. Othermaterials or methods for forming the micro-wires 30, such as curable inkpowders including metallic nano-particles, can be employed and areincluded in the present invention.

An imprinting stamp having portions that protrude by different amountsto form the micro-channel 60, micro-channel bottom 65, and ribs 20 canbe made through repeated exposures through a stack of ordered masks. Forexample a transparent stamp substrate is provided and coated with firststamp curable layer and exposed through a first mask with a firstpattern, for example a flat stamp structure corresponding to themicro-channel floor 65. The first stamp curable layer is cured, forexample with radiation. A second stamp curable layer is coated over thecured first stamp curable layer and exposed through a second mask with asecond pattern having exposed portions that are a subset of the firstmask, for example stamp structures corresponding to the ribs 20 and thefirst and second micro-channel side walls 64, 66. The second stampcurable layer is cured, for example with radiation. A third stampcurable layer is coated over the cured second and first stamp curablelayers and exposed through a third mask with a third pattern havingexposed portions that are a subset of the second mask, for example stampstructures corresponding to the first and second micro-channel sidewalls 64, 66. The third stamp curable layer is cured, for example withradiation. The formed imprinting multi-level stamp can then be used forimprinting cured layers 10 as described above.

Methods and device for forming and providing substrates, coatingsubstrates and other layers, patterning coated substrates or layers, orpattern-wise depositing materials on a substrate or layer are known inthe photo-lithographic and coating arts. Hardware controllers forcontrolling displays and touch screens and software for managing displaysystems are all well known. All of these tools and methods are usefullyemployable to design, implement, construct, and operate the presentinvention. Methods, tools, and devices for operating displays and touchscreens can be used with the present invention.

The present invention is useful in a wide variety of electronic devices.Such devices can include, for example, photovoltaic devices, OLEDdisplays and lighting, LCD displays, inorganic LED displays andlighting, electrophoretic displays, and electrowetting displays.

The invention has been described in detail with particular reference tocertain embodiments thereof, but it will be understood that variationsand modifications can be effected within the spirit and scope of theinvention.

PARTS LIST

-   D distance-   S separation-   5 imprinted micro-wire rib structure-   8 substrate-   10 cured layer-   11 cured-layer surface-   12 curable layer-   20 rib/first rib-   21 second rib-   22 rib width-   24 rib height/first rib height-   25 second rib height-   26 rib top-   30 micro-wire-   31 conductive material-   32 electrical conductor-   40 display area-   50 peripheral area-   60 micro-channel-   62 micro-channel width-   64 first micro-channel side-   65 micro-channel bottom-   66 second micro-channel side-   68 micro-channel depth-   70 nano-particle-   80 connection pad-   85 controller-   90 electrode-   100 provide substrate step-   105 form curable layer over surface step-   110 stamp curable layer to form micro-channels step-   115 cure curable layer step-   120 remove stamp step-   125 coat cured layer surface and micro-channels with curable    material step-   130 remove excess curable material from cured layer surface step-   135 cure curable material step-   200 form micro-wires on substrate in peripheral area step-   210 form electrodes on substrate in display area step-   220 form connection pads on substrate in peripheral area step-   230 align substrate with display step

1. A micro-wire rib structure, comprising: a substrate; a cured layerformed on or over the substrate, the cured layer having a cured-layersurface; a micro-channel imprinted in the cured layer, the micro-channelhaving a micro-channel depth, a micro-channel bottom, first and secondmicro-channel sides, and one or more ribs having opposing rib sides anda rib top defining a rib height less than the micro-channel depth, eachrib located between the first and second micro-channel sides andextending from the micro-channel bottom toward the cured-layer surface;a cured electrical conductor forming a micro-wire in the micro-channel,the micro-wire extending continuously from the first micro-channel side,over the micro-channel bottom, the rib side(s) and rib top(s), to thesecond micro-channel side forming a continuous electrical conductor fromthe first micro-channel side to the second micro-channel side.
 2. Themicro-wire rib structure of claim 1, wherein the cured electricalconductor includes sintered conductive nano-particles.
 3. The micro-wirerib structure of claim 1, wherein the micro-channel includes first andsecond ribs, the first rib having a first height and the second ribhaving a second height different from the first height.
 4. Themicro-wire rib structure of claim 1, wherein the rib has a rib width andthe micro-channel has a micro-channel width and the rib width is lessthan or equal to 20% of the micro-channel width.
 5. The micro-wire ribstructure of claim 1, wherein the micro-channel includes first andsecond ribs, the first rib having a first width and the second ribhaving a second width different from the first width.
 6. The micro-wirerib structure of claim 1, wherein the rib height is greater than orequal to one half of the micro-channel depth.
 7. The micro-wire ribstructure of claim 1, wherein the micro-channel has a micro-channelwidth greater than or equal to 20 microns.
 8. The micro-wire ribstructure of claim 1, wherein the micro-channel has a micro-channelwidth greater than or equal to 10 microns.
 9. The micro-wire ribstructure of claim 1, wherein the micro-channel has a micro-channelwidth greater than or equal to 5 microns.
 10. The micro-wire ribstructure of claim 1, wherein the distance between the firstmicro-channel side and the nearest rib side is less than 20 microns. 11.The micro-wire rib structure of claim 1, wherein the distance betweenthe first micro-channel side and the nearest rib side is less than 10microns.
 12. The micro-wire rib structure of claim 1, wherein thedistance between the first micro-channel side and the nearest rib sideis less than 5 microns.
 13. The micro-wire rib structure of claim 1,further including an electrode and a connection pad formed over thesubstrate, and wherein the micro-wire electrically connects theelectrode and the connection pad.
 14. The micro-wire rib structure ofclaim 13, wherein the micro-wire is a bus.
 15. The micro-wire ribstructure of claim 13, further including a plurality of electrodes andmicro-wires and a corresponding plurality of connection pads formed overthe substrate, a micro-wire connecting each of the electrodes to acorresponding connection pad.
 16. The micro-wire rib structure of claim15, wherein each micro-wire is separated from an adjacent micro-wire bya distance less than or equal to 50 microns.
 17. The micro-wire ribstructure of claim 15, wherein each micro-channel has a width and eachmicro-wire is separated from an adjacent micro-wire by a distance lessthan or equal to the width of the micro-channel.
 18. The micro-wire ribstructure of claim 15, wherein the substrate is transparent and has adisplay area and a separate peripheral area and wherein the electrodesare located at least partly in the display area and the micro-wires arelocated in the peripheral area, and wherein the peripheral area has alower transparency than the display area.
 19. The micro-wire ribstructure of claim 15, wherein the peripheral area has a transparencyless than or equal to 80%.